{"product_id":"disco-corporation-zh05-sd2000-n1-130-a1434-bb-diamond-dicing-blade","title":"DISCO Corporation ZH05-SD2000-N1-130-A1434-BB Diamond Dicing Blade","description":"\u003cdiv\u003eDISCO Corporation ZH05-SD2000-N1-130-A1434-BB is a silicon wafer diamond dicing blade designed for precise cutting of silicon substrates. Built for wafer-dicing operations, this blade uses diamond abrasive to deliver clean, controlled cuts during semiconductor fabrication. The part number identifies this specific blade model within DISCO’s family of wafer-dicing blades, clarifying its role in the silicon wafer processing workflow.\u003c\/div\u003e","brand":"Disco","offers":[{"title":"New","offer_id":51680912441646,"sku":null,"price":581.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0940\/0818\/1038\/files\/Ebay_website_image_ef3041ac-b96c-4d93-a60b-2091c99f07b3.jpg?v=1769630485","url":"https:\/\/plgautomation.com\/products\/disco-corporation-zh05-sd2000-n1-130-a1434-bb-diamond-dicing-blade","provider":"PLG Automation ","version":"1.0","type":"link"}