Asahi Diamond Industries SAS-B46-MA42380 Diamond Grinding Dish Wheel

The 5-inch SAS-B46-MA42380 Diamond Grinding Dish Wheel from Asahi Diamond Industries is a diamond-abrasive wheel designed for wafer surface grinding. It targets silicon semiconductor wafers, compound semiconductor wafers, wide-bandgap wafers such as SiC and GaN, SAW filter wafers (LT/LN), and sapphire or glass wafers, with Asahi noting it can be customized to match each material and process. The wheel is engineered to minimize machining damage and improve grinding efficiency, aligning with Asahi's emphasis on material-specific wheel optimization. As a 5-inch dish-style wheel, SAS-B46-MA42380 is intended for use in specialist lab or production grinding systems that handle ultra-hard wafer materials.