Industrial IPV200M TV19.9 LEGO-2 Testing Probe Assembly Head

Celadon Systems IPV200M TV19.9 LEGO-2 Testing Probe Assembly Head is a high-precision probe head designed for electrical contact in semiconductor test equipment, intended to interface with wafer- and packaged-device test setups during reliability and parametric testing. As part of Celadon’s probe-head family, it leverages cantilever-based contact concepts and aims for stable, low-impedance performance in demanding environments. Celadon’s patent portfolio, including shielded probe configurations and replaceable probe cores, underpins the company’s emphasis on durable, multi-site probing solutions. Typical applications include wafer-level reliability testing, parametric measurements, and device characterization where accurate probe alignment and repeatable contact resistance are critical. The IPV200M TV19.9 LEGO-2 designation suggests a modular, industrial-grade head designed for integration with Celadon's testing hardware.