Techspray 1978DP Silicone Free Heat Sink Compound

Techspray 1978DP Silicone Free Heat Sink Compound is a silicone-free thermal interface paste delivering 0.92 W/m·K to maximize heat transfer between electronic components and heatsinks, without silicone contamination. It remains stable under normal operating conditions, will not separate, harden, or crack, and is packaged in a 4 oz tube for reliable replacement of thermal interface materials. Commonly applied to power semiconductors, CPUs, power supplies, thermocouples, thermistors, calrods, LEDs, and industrial electronic control equipment to sustain efficient thermal dissipation in automotive electronics, telecommunications gear, and other OEM environments. Manufactured by Techspray (MPN 1978DP), this silicone-free compound supports a service range from -40°C to 200°C (-40°F to 392°F), is non-ozone depleting, and is intended for maintenance, electronic assembly, preventive maintenance, and component life extension for system integrators and electronics manufacturers alike.